Brand Name : Found
Model Number : FD-060
Certification : UL E361831
Place of Origin : China
MOQ : 1 PC
Price : negotiable
Payment Terms : T/T
Supply Ability : 10 000
Delivery Time : 5-8 work days
Packaging Details : Vacuum Packing
Base material : Aluminum Base,FR-4/aluminum/ceramic/cem-3/FR-1
Surface finishing : Immersion Gold
Product name : Pcb Board Assembly
Type : led light pcb board design
Application : led light pcb board design
Usage : plant led growth box lighting
Item : Customize pcba
Items | Speci. | |
Max panel size | 32" x 20.5"(800mm x 520mm) | |
Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | |
Min PAD (inner layer) | 5 mil(0.13mm) | |
Min thickness(inner layer) | 4 mil(0.1mm) | |
Inner copper thickness | 1~4 oz | |
Outer copper thickness | 0.5~6 oz | |
Finished board thickness | 0.4-3.2 mm | |
Board thickness tolerance control | ±0.10 mm | ±0.10 mm |
±10% | ±10% | |
±10% | ±10% | |
Inner layer treatment | brown oxidation | |
Layer count Capability | 1-30 LAYER | |
alignment between ML | ±2mil | |
Min drilling | 0.15 mm | |
Min finished hole | 0.1 mm | |
Hole precision | ±2 mil(±50 um) | |
tolerance for Slot | ±3 mil(±75 um) | |
tolerance for PTH | ±3 mil(±75um) | |
tolerance for NPTH | ±2mil(±50um) | |
Max Aspect Ratio for PTH | 8:1 | |
Hole wall copper thickness | 15-50um | |
Alignment of outer layers | 4mil/4mil | |
Min trace width/space for outer layer | 4mil/4mil | |
Tolerance of Etching | +/-10% | |
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) |
at trace corner | ≥0.2mil(5um) | |
On base material | ≤+1.2mil Finished thickness | |
Hardness of solder mask | 6H | |
Alignment of solder mask film | ±2mil(+/-50um) | |
Min width of solder mask bridge | 4mil(100um) | |
Max hole with solder plug | 0.5mm | |
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | |
Max Nickel thickness for Gold finger | 280u"(7um) | |
Max gold thickness for Gold finger | 30u"(0.75um) | |
Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | |
Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | |
Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | |
Trace Anti-stripped strength | ≥61B/in(≥107g/mm) |
Other less common and more expensive fabrication options include:
Buried and Blind Vias (internal layers are built using either foil or cap lamination)The process is essentially the same as a standard stackup and lamination. However, the lamination process may need to be repeated several times to capture the vias internally and still complete the needed electrical connections.
Cap Lamination: Instead of starting with a core and building out using prepreg and foil, this process puts the core on the outer layers and then prepreg in the middle. The process to laminate is less stable and requires the correct press and tools to accomplish.
Spacing Requirements
Not only does material composition of the boards need to be considered, but so does the spacing between layers. There are two types of spacing materials that can be used: core (copper-plated, glass-reinforced epoxy laminated sheets with a typical thickness between 0.004” and 0.040”) or prepreg (a reinforced sheet impregnated with resin, typical thickness between .002” and .007”).
Closing Thoughts
A well-designed stackup and effective fabrication method can help you ensure the right build for your multi-layer PCBs. While most PCB manufacturers utilize a set of standard stackups, it’s also very common to utilize a stackup defined as a part of the project requirements. Whenever possible, it’s a good idea to leverage your PCB manufacturer’s knowledge & experience to validate a proposed stackup
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